We will start by removing the back cover, for this we will use a plastic opening tool to separate it from the phone.

After removing the back cover we will have access to the battery. Removing it will be very easy using the plastic opening tool.

Before removing the intermediate housing we will have to remove the SIM and microSD cards. Using a clamp or fingers, we will pull the cards to extract them.

To remove the intermediate casing, first we will have to remove the ten Phillips screws (PH # 00) that attach this to the chassis. Then we introduce a spike between the frame and the casing to release the notches to which it is still attached.

To get to the handset we will have to remove the motherboard. For this we will remove the only screw that still holds it and disconnect the components.

In this step, we disconnected the interconnection flex from the base plate to the bottom plate and the flex of the front camera.

Now we will disconnect the flex from the digitizer and the touch screen.

From the bottom plate we will disconnect the coaxial antenna cable.

In this step we will need to heat the glass to soften the glue and thus be able to remove the screen more easily.

Below we will see two ways to perform this step.

We will use a high thermal retention blanket (HOT GLASS) to heat the glass.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute the heat through the hands of the HOT GLASS.

The gun emits VERY hot air, use with caution.

We recommend the use at minimum power and short bursts, since excess heat can damage the equipment.

Warm the screen to soften the glue and be able to easily peel it off.

With the hot screen we introduce the spike between it and the frame to take it off.

After detaching the screen, before separating it, we will slide the flex cable from it through the hole in the chassis.