We will start by removing the tray from the SIM card to avoid damaging the equipment when removing the intermediate case.

We will remove the back cover, with the help of an opening tool we will unhook the notches that hold it.

We remove the intermediate casing in two parts. We remove the ten Phillips screws (PH # 00) that hold it and then disengage the bottom, which is the antenna module and speaker.

Now, to remove the upper part of the intermediate housing, we will release the notches that hold it with the help of the opening tool.

In order to remove the motherboard we will first have to disconnect the components connected to it. We will disconnect the flex from the screen, the battery and the cameras. We will take care, at the time of removing the plate, separating the flex cables so that they do not get caught.

In this step we will take off the flex from the screen of the phone's chassis to be able to later remove the screen.

We will also remove the battery to avoid damage when heating the window to soften the adhesive.

In order to be able to remove the screen more easily, we will heat it to about 80ºC for thirty seconds and thus we will soften the adhesive.

Once hot, we will introduce a spike between the screen and the frame, and sliding it around the contour of the phone, we will remove the adhesive.

We will take care at the bottom of the phone because if we introduce the barb too much we could damage the flex of the screen.

Now we can only slide the screen flex through the hole in the chassis to remove it.