We will start by heating the back cover to soften the adhesive that holds it. We will heat it to about 50ºC for about a minute.

With the hot lid, we will introduce an opening tool between it and the frame. We will slide it around the contour to remove the glue.

We remove the six screws that hold the module and then we unlock it.

In this step we will remove the shielding of the plate and the antenna module. To do this, we will remove the seven screws that we pointed out in the first image. After removing the screws, we can disengage them.

To remove the SIM and SD cards, we will use the tray removal tool. We will introduce the tip of the tool through the hole in the tray and press lightly until it is ejected automatically.

In this step we will disconnect the components that are connected to the motherboard. We will disconnect the battery, the screen flex, the audio connector and the flex with sensors.

After disconnecting all the components, we can disengage the motherboard.

In this step we will simply detach the flex from the chassis to be able to later remove the screen.

Although it is not absolutely necessary, we can take off the battery as we will have to heat the screen.

To soften the adhesive that holds the screen to the chassis we will have to warm it up. We will heat it to about 70ºC for about a minute. It may be necessary to heat it several times during the process.

To make it easier to insert a tool between the screen and the frame, we can take advantage of the holes in the chassis to introduce something flat that slightly lifts the screen.

With the hot screen, we will slide an opening tool between it and the frame to remove the adhesive.

The adhesive on this screen is quite sturdy and it may be a bit difficult to remove it.

Once detached, we will slide the flex through the chassis to be able to remove the screen.