We started by opening the back cover. We will heat it to 60ºC during a minute approximately to soften the adhesive and, with a flat opening tool, we will take it off by sliding it all over the contour.

Remove the three Phillips screws (PH # 00) that hold the shields of the contacts on the motherboard and disconnect the flex from the screen, the flex from the fingerprint reader, the battery and the interconnection flex.

We will heat the device to soften the adhesive. With a card we will remove all the possible adhesive to be able to introduce a tool with which to pry.