We started by heating the screen at about 70 ° C for about a minute to soften the adhesive.

With the hot screen, we introduce a prong or other opening tool between it and the frame. Sliding it around the contour will get it off.

We remove the covers that cover the contacts where the flexes of the screen are connected to disconnect them and be able to remove it.

Remove the eleven Phillips screws that hold the intermediate casing and disengage it.

We disconnect the components of the motherboard and remove the SIM / SD tray.

Now we can undo the chassis plate.

Remove the support of the side buttons. After that, all that remains is to detach the sensors from the chassis.