We started by heating the screen at about 70 ° C for about a minute to soften the adhesive.

With the hot screen, we introduce a prong or other opening tool between it and the frame. Sliding it around the contour will get it off.

We remove the covers that cover the contacts where the flexes of the screen are connected to disconnect them and be able to remove it.

Remove the eleven Phillips screws that hold the intermediate casing and disengage it.

We disconnect the components of the motherboard and remove the SIM / SD tray.

Now we can undo the chassis plate.

In this step we will take off the rear trim. For this we can warm it slightly to soften the adhesive and make it easier to peel it off.

Then we remove the antenna that acts as the headset cover and the microphones.

To finish, we will take off the flex on both sides of the chassis.