To remove the microSD card we just have to lift the lid and press the card.

To remove the SIM cards we will introduce a fine tip tool to remove the trays.

We remove the back cover using a plastic tool to avoid damage. By levering, we will disengage the casing.

Remove the screws of both the lower module and the intermediate housing to access the two ends of the cable.

We disconnect both ends of the cable and remove it.

To remove the case remove the 4 screws without passing the hidden one. We also remove the metal sheet and its respective screws.

We disconnect both ends of the cable and remove it. Also disconnect the flex battery and the bottom plate.

With the help of a spatula or similar we will remove the battery taking care not to bend it. Then we will take off the flex from the bottom plate of the chassis.

We take off the plate from the bottom.

We disconnect the flex from the touch screen and remove the motherboard. Now we have access to another part of the screen flex which we will take off from the chassis.

We take off the flex of the chassis display.

In this step we will heat the screen to soften the glue and thus remove the glass more easily.

We will use a high thermal retention blanket (HOT GLASS) to heat the glass.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

After heating the screen ... ZASCA! the glass has cracked, now that we will have to continue with the screen in pieces. Very carefully , especially not to cut, we will take off the screen with the help of a tool, in this case the spatula.