With a SIM extraction tool we remove the SIM tray.

We unhook the back cover with an opening tool and remove it.

Unscrew the Phillips screws (PH # 00) that hold the upper intermediate housing.

We unhook it and remove it.

We disconnect the flex from the battery, take it off and remove it.

We apply heat to the screen at eighty degrees for two minutes.

We introduce a metal spike between the central housing and the screen. We exchanged it with a plastic spike to avoid scratching the housing.

We perform the entire contour by taking off the screen.

Unscrew the Phillips screws (PH # 00) that hold the lower intermediate housing and remove it.

We disconnect the flex from the screen of the motherboard and the auxiliary plate.

We remove the screen.