We start by heating the lid to soften the adhesive and make it easier to peel it off. We heat it to about 65 ° C for about a minute.

With the hot back cover, we slide a flat tool around the contour between it and the frame. Once detached, we will disconnect the fingerprint reader to separate it.

Take off the NFC antenna, remove the nine Phillips screws (PH # 00) that hold the intermediate housing and disengage it.

Remove the seven screws that hold the loudspeaker module and the intermediate internal casing and disengage them.

In this step we disconnect the components of the motherboard.

We disconnect the base plate of the auxiliary plate by lifting it from the bottom. Remove the two Phillips screws (PH # 00) that hold the plate and also the SIM / SD tray.

Now we can undo the motherboard.

All that remains is to take off and disengage the headset from the chassis.