We will start by removing the SIM and microSD cards. For this we will use the tray opening tool that the phone brings us. Pressing through the holes in the trays will eject them.

In this step we will need to heat the glass to soften the glue and thus be able to remove the screen more easily.

Below we will see two ways to perform this step.

We will use a high thermal retention blanket (HOT GLASS) to heat the glass.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

The gun emits VERY hot air, use with caution.

We recommend the use at minimum power and short bursts, since excess heat can damage the equipment.

Warm the screen to soften the glue and be able to easily peel it off.

With the hot screen, we will introduce a spike between the frame and the glass to be taken off. We will help with a suction cup to be able to introduce the tine more easily.

The screen is also pasted by the center, we will introduce a longer tool to take it off. We will do this step very carefully so as not to damage the insulation of the screen.

Special attention must be paid when removing the lower part of the phone so as not to damage the flex lights of the buttons. When taking off this part, we will avoid laterally moving the barb, especially in the areas of the buttons.

To finally remove the screen, we will have to disconnect it first from the motherboard.

In order to extract the chassis we will have to first remove the twelve Phillips screws (PH # 00) that hold it. Once removed, we will use a spatula to pry it off the frame.

Finally, in order to remove the battery, we will have to detach it from the chassis. With the help of a spatula or other tool, we will take it off very carefully so as not to damage it since it is very well attached.