You will need to apply heat to the equipment, in order to soften the glue and to peel off easily. We suggest the use of HOT GLASS, with high thermal retention.

Insert the HOT GLASS in the microwave for the time specified in the instructions.

To heat it evenly, it is necessary to interrupt the microwave every 30 seconds to distribute heat throughout the HOT GLASS with your hands.

Apply heat to the plastic covers on the top and bottom of the screen, where the microphone and handset are located.

Peel off the lower and upper covers with the pick. Apply enough heat until it comes off easily.

Remove the screws that hold the housing.

• 2 Phillips screws (top)
• 4 Torx screws (bottom)

We advise you to use an interchangeable tip screwdriver.

Remove the nano SIM, micro SD trays next to the cards.

Slowly, take off the back cover, starting at the top:

Start by inserting the tine between the cover and the frame of the housing. Continue separating with the double opening tool (green), combining it with lever movements with the simple opening tool (black).

Separate the back cover.

Remove the plastic support that partially covers the connector of the front camera and the adhesive that holds it.

Disconnect from the motherboard and remove the front camera.